Diamond Thermal Solutions

Diamond Heat Spreaders and Thermal Components for High-Power Electronics

Infinite Exploration supplies MPCVD single-crystal and polycrystalline diamond thermal materials through qualified manufacturing partners, and coordinates custom dimensions, metallization and bonding configurations for U.S. customers.

W/m·K thermal conductivity at room temperature, by grade
Up to ~2,200
polycrystalline wafers; single-crystal up to 35 × 35 mm
Up to 8 in.
standard thickness; up to 1.5 mm on request
10–1,000 µm
achievable surface roughness (single-crystal)
Ra ≈ 1 nm

Manufacturing-partner reported values. Final specifications are confirmed in each quotation.

Overview

Why diamond for thermal management

As power density rises in semiconductors, RF devices and lasers, the limiting factor is often not the heat sink but the first millimeter of the heat path: localized hot spots under the die that conventional copper or ceramic spreaders cannot dissipate fast enough.

Diamond has one of the highest thermal conductivities of any known material. Placed directly beneath or near the heat source, a diamond heat spreader distributes concentrated heat across a larger area before it reaches the package, heat sink or cold plate — lowering peak junction temperature and improving reliability margins.

Selecting the right diamond product depends on grade, thickness, surface preparation, metallization and how it is bonded into the assembly. We help match those parameters to your application and coordinate samples and production with our manufacturing partners.

Product categories

Products & Offerings

Published values are reported by our manufacturing partner. Items marked as available upon request are confirmed from supplier documentation for each inquiry.

  • Component sourcing
  • Custom manufacturing coordination

CVD Diamond Heat Spreaders

Chemical vapor deposition (CVD) diamond plates that spread concentrated heat away from high-power devices before it reaches the next layer of the thermal stack.

Applications

  • High-power semiconductor devices
  • Advanced chip packaging
  • RF power electronics
  • Laser systems and laser diodes
  • High heat flux electronics
CVD Diamond Heat Spreaders — technical specifications
SpecificationValue
MaterialMPCVD single-crystal or polycrystalline diamond
Thermal conductivity (room temp.)1,000–2,200 W/m·K depending on grade — single-crystal up to ~2,200, polycrystalline up to ~2,000
DimensionsSingle-crystal up to 35 × 35 mm; polycrystalline parts cut from 2–8 in. wafers; custom sizes
Thickness10–1,000 µm standard; up to 1.5 mm on request
Surface roughnessRa ≈ 1 nm achievable (single-crystal); ≈ 2 nm (polycrystalline)
Flatness & thickness toleranceEvaluated per size and thickness — contact us for specifications
MetallizationFull-surface and patterned metallization available
Bonding optionsCopper plating and brazing; other bonding processes evaluated per project
Test reportLaser-flash thermal conductivity report; third-party testing available at additional cost
MOQRequest quotation
Lead timeBased on specification and quantity

Values reported by our manufacturing partner. Room-temperature thermal conductivity measured by laser flash; maximum values are the upper end of the grade range, not guaranteed minimums. Final specifications are confirmed in each quotation.

  • Component sourcing
  • Custom manufacturing coordination

Polycrystalline Diamond Thermal Materials

Polycrystalline diamond plates and substrates for heat spreading and high-performance electronic packaging where thermal performance must be balanced against size and cost.

Applications

  • Heat spreading
  • High-performance electronic packaging
  • Thermal management substrates
  • Customized thermal components

Single-crystal diamond is not currently available in large sizes anywhere in the industry. Full-area diamond heat spreading for large chips therefore uses polycrystalline diamond.

Polycrystalline Diamond Thermal Materials — technical specifications
SpecificationValue
MaterialMPCVD polycrystalline diamond
Thermal conductivity (room temp.)Up to ~2,000 W/m·K depending on grade
Wafer size2–8 in. diameter; 6 in. and 8 in. in volume production
Cut partsLaser cutting and precision machining to drawing
Thickness10–1,000 µm standard; up to 1.5 mm on request
Surface roughnessRa ≈ 2 nm (AFM, 5 × 5 µm area)
Large-area uniformityMinor edge-to-center variation; data provided per quotation
MOQRequest quotation
Lead timeBased on specification and quantity

Values reported by our manufacturing partner. Room-temperature thermal conductivity measured by laser flash; maximum values are the upper end of the grade range, not guaranteed minimums. Final specifications are confirmed in each quotation.

  • Custom manufacturing coordination

Metallized Diamond Substrates

Diamond with metallized surfaces prepared for soldering, brazing or other bonding processes, so the spreader can be integrated directly into a device package or module.

Configurations

  • Diamond with metallized surfaces
  • Diamond–metal bonding solutions
  • Custom metallization structures
  • Application-specific thermal interfaces
Metallized Diamond Substrates — technical specifications
SpecificationValue
Base materialMPCVD single-crystal or polycrystalline diamond
MetallizationFull-surface and patterned metallization
Metallization stackDefined per application — contact us for specifications
Bonding processesCopper plating, brazing; other processes evaluated per project
Interface thermal resistanceReference ranges for selected bonding methods — available upon request
Dimensions & thicknessContact us for specifications
MOQRequest quotation
Lead timeBased on specification and quantity

Values reported by our manufacturing partner. Room-temperature thermal conductivity measured by laser flash; maximum values are the upper end of the grade range, not guaranteed minimums. Final specifications are confirmed in each quotation.

  • Custom manufacturing coordination

Custom Diamond Thermal Components

Application-specific diamond components manufactured to your drawing or requirements through our manufacturing partners. Share your target parameters and we coordinate feasibility, samples and production.

Customizable parameters

  • Length and width
  • Thickness
  • Surface finish
  • Metallization
  • Bonding configuration
  • Thermal conductivity grade
  • Dimensional tolerance

Specifications by requirementSpecifications are defined against your application and confirmed with supplier documentation.

Contact us for specifications

Technical considerations

What to Specify — and Why It Matters

Thermal conductivity grade

Higher grades improve spreading but affect cost. The right grade depends on heat flux, spreader size and how much of the total thermal resistance the spreader represents.

Thickness vs. spreading

Spreader thickness changes lateral heat spreading and through-thickness resistance. Thickness should be selected against the device footprint and heat path.

Interface resistance

Bond lines and interface materials can dominate total thermal resistance. Metallization and bonding method should be specified together.

CTE mismatch

Diamond expands far less with temperature than most metals and some semiconductors. Bonding approach and dimensions should account for thermal cycling stresses.

Surface flatness & finish

Flatness and roughness affect contact quality and bond-line thickness. Specify requirements based on your assembly process.

Verification & reliability

Supplier laser-flash data is provided with quotations. Reliability testing such as thermal cycling and shock is performed during customer qualification — we recommend sample evaluation in your own setup before volume orders.

Application scenarios

Typical Use Cases

Representative application scenarios — illustrative examples, not customer case studies.

RF power amplifiers

Diamond heat spreaders beneath GaN or GaAs RF devices to reduce hot-spot temperature in high-power transmit modules.

Laser diode submounts

Metallized diamond submounts for laser diodes and laser bars where wavelength stability and lifetime depend on junction temperature.

Power semiconductor modules

Spreader layers in high-power semiconductor modules where localized heat flux limits device rating.

Advanced packaging

Heat spreading in advanced and heterogeneous packages with concentrated hot spots.

Engagement

How a Project Moves Forward

  1. 01

    Share requirements

    Material type, dimensions, thickness, thermal targets, finish and metallization needs.

  2. 02

    Specification matching

    We match requirements to supplier capability and confirm documentation.

  3. 03

    Sample evaluation

    Samples and supplier test data for evaluation in your own setup.

  4. 04

    Custom production

    Production coordinated with our manufacturing partners to your specification.

  5. 05

    Ongoing supply

    Repeat orders, documentation and delivery coordination for your programs.

Request Technical Specifications

Share your requirements for diamond thermal solutions and our team will follow up with suitable options and next steps.